Will fine circuit traces soon become ubiquitous?
In the manufacture of industrial applications, more and more industry sectors are turning to a new technology as an alternative to classic PCBs. The revolution is called 3-D MID (Moulded Interconnect Devices or Mecha-tronic Integrated Devices) – injection-moulded plastic parts with conduc-tive traces integrated by using laser direct structuring (LDS). This technique adds power to the trend towards miniaturisation in the electronics industry and provides product developers with new design op-portunities. The projects from Multiple Dimensions, illustrates the diversity of possible ap-plications for 3D-MID. They simplify the operation of household appliances, improve driver experience in power steering systems and open new ways of saving space — for example in sensing and industrial electronics. These fine, golden traces on formed plastic are transforming industrial produc-tion. The basis of all 3D-MID applications is a thermoplastic material: Using injection- moulding, first manufacture the part to fit the customer’s application, using different types of thermoplastic, which contain an additive that can be activated by laser. A laser ray then engraves the surface of the plastic and activates the additive. A copper bath then follows, which lets the conductive traces form directly on the thermoplastic. Depending on the type of application, the MID parts may have to be extremely robust or temperature-resistant. Some even must be acid or sweat-resistant, for example applications for hear-ing aids or headphones. In a final step, a barrier layer of nickel is applied and then conditioned with a thin layer of gold to ensure good solderability. What differentiates the company from the competition is that it produces trac-es in almost microscopically small dimensions. Their manufacturing expertise can compete with anyone in the world, especially their uniquely fine trace width and the narrow spacing between traces. Most suppliers are currently working with 300 – 400 µm spacing between trac-es. At Multiple […]